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CUSTOMIZED PACKAGING

The strength of Aeroflex / Weinschel's SmartStep design approach starts with an experienced engineering design staff. Using today’s modern design tools and the latest software allows Weinschel's engineering staff to offer its customers a wide range of customized mechanical packaging & modular design solutions.

Specific PCB and driver configurations can be designed for operating various types of devices or retrofitting an existing device to operate with our SmartStep Approach!

Subsystems are easily configured for mounting into any rack or cabinet designed per EIA RS-310 or MIL-STD-189.

Although Aeroflex / Weinschel specializes in the design of customized module and cabinet configurations, most subsystems are designed using off-the-shelf components, devices and cabinet configurations which allows Weinschel to design and manufacture subsystems with reduced lead times as well as lower overall design cost.

 

 

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© 2004 Aeroflex / Weinschel, Inc.
Last Revised 5-3-06